AMD Instinct MI300X

AMD designed the MI300X for superior artificial intelligence (AI) and high-performance computing (HPC) performance, featuring up to 192 GB of HBM3 memory with 5.2 TB/s bandwidth. It excels in handling large language models (LLMs) and advanced AI workloads, offering unmatched efficiency and scalability for data centers, making it the ideal choice for next-gen AI solutions.

Key Features

Designed to accelerate modern workloads - Push high-performance computing (HPC) applications to new heights
Powered by 4th gen Infinity architecture - AMD Infinity Fabric technology delivers excellent I/O efficiency, scaling, and communication within and between industry-standard accelerator module (OAM) device packages
Multi-chip architecture - The MI300X uses state-of-the-art die stacking and chiplet technology in a multi-chip architecture

Specifications

Form Factor	OAM module
Lithography	5nm FinFET
Active Interposer Dies (AIDs)	6nm FinFET
GPU Compute Units	1216
Matrix Cores	1216
Stream Processors	19,456
Peak Engine Clock	2100 MHz
Memory Capacity	Up to 192 GB HBM3
Memory Bandwidth	5.3 TB/s max. peak theoretical
Memory Interace	8192 bits
AMD Infinity Cache™ (last level)	256 MB
Memory Clock	Up to 5.2 GT/s
Scale-up Infinity Fabric™ Links	1 PCIe® Gen 5 x16 (128 GB/s)
I/O to host CPU	1 PCIe® Gen 5 x16 (128 GB/s)
Scale-out network bandwidth	PCIe Gen 5 x16 (128 GB/s)
RAS features	Full-chip ECC memory, page retirement, page avoidance
Maximum TBP	750W

For full product specifications and parts list - download the AMD Instinct MI300X data sheet.

Request a Quote Today

To find out more about our extensive product range and how it will benefit your datacentre deployment, please don’t hesitate to get in touch below and we’ll get back to you quickly.

Get in touch

Privacy & Cookie Policy: By accessing this website you agree to accept cookies. Read the Privacy Policy.

AMD Instinct MI300X

Accelerate your generative AI workloads with the AMD Instinct MI300X